ML605GTWIII(-P)-5200U
2-beam 2-PCB processing machine
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Productivity
A newly developed ultrahigh-speed galvano system and 200W high-power oscillator increase processing speed significantly. The highest productivity in the industry has been realized.
Package substrate processing
Mitsubishi's own optical technology ensures high-quality, high-precision drilling of micro via-holes in the newest type of package substrate materials.
Flexibility
Mitsubishi's unique high-power, high-peak oscillator and optimal beam control enable a wide range of processing conditions to be set according to the machining requirements. As a result, a single machine is capable of handling various machining tasks on a variety of materials.
Quality & Cost Performance
A simple spectroscopic system is adopted, which minimizes heat effect, realizing high processing quality and stability. As a result, amount of time required for maintenance is dramatically reduced.
Periodic replacement of the laser oscillator is not required, allowing operating cost to be kept to a minimum and eliminating the need for long machine downtime to replace the oscillator. Furthermore, the new laser oscillator (5200U) successfully achieves a 50% reduction in laser gas consumption.
41st Ichimura Industrial Award (Achievement award)
We have received the Ichimura Industrial Award for our "High-speed technology on PCB hole drilling laser machines" for our outstanding achievement in the industrial field in light of our unique homegrown technology.
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