ML605GTF-5150U
Package board dedicated machine
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Mitsubishi's original spectroscopic technique enables 4 beam simultaneous high-speed processing.
It made excellent progress in the productivity of package boards.
Adoption of the in-house high light-harvesting f theta lens controls damage around the hole, dramatically improving processing quality of the package board material.
The processing position accuracy is equivalent to that of an established 2 beam machine.
It meets the requirements of a high accuracy processing.
41st Ichimura Industrial Award (Achievement award)
We have received the Ichimura Industrial Award for our "High-speed technology on PCB hole drilling laser machines" for our outstanding achievement in the industrial field in light of our unique homegrown technology.
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